Power chips are connected to exterior circuits via product packaging, and their performance relies on the assistance of the packaging. In high-power situations, power chips are typically packaged as power modules. Chip interconnection refers to the electric link on the upper surface area of the chip, which is generally light weight aluminum bonding cable in traditional components. ^
Standard power component package cross-section
Currently, industrial silicon carbide power components still mainly utilize the packaging innovation of this wire-bonded standard silicon IGBT module. They face troubles such as big high-frequency parasitical criteria, insufficient heat dissipation capability, low-temperature resistance, and inadequate insulation strength, which limit making use of silicon carbide semiconductors. The screen of superb performance. In order to solve these issues and fully exploit the huge potential benefits of silicon carbide chips, numerous new packaging modern technologies and options for silicon carbide power modules have emerged recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cords to copper cables, and the driving force is cost reduction; high-power tools have developed from aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance product performance. The better the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared with traditional bonding packaging techniques, Cu Clip innovation has the adhering to advantages:
1. The link in between the chip and the pins is made of copper sheets, which, to a certain level, changes the standard cable bonding method in between the chip and the pins. For that reason, an unique package resistance worth, higher existing flow, and far better thermal conductivity can be gotten.
2. The lead pin welding location does not need to be silver-plated, which can totally conserve the cost of silver plating and inadequate silver plating.
3. The product look is totally constant with typical items and is mainly utilized in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is much more costly and complex, however it can attain better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding approach
The source pad uses a Clip method, and eviction makes use of a Cable technique. This bonding approach is somewhat less costly than the all-copper bonding approach, conserving wafer area (applicable to extremely little entrance locations). The procedure is less complex than the all-copper bonding technique and can get better Rdson and much better thermal result.
Distributor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper strip, please feel free to contact us and send an inquiry.
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